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Best Throughput for Inline Production |
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Read-on-the-Fly technology provides a vibration free imaging of PCB with high throughput. The inspection speed is only 14 seconds for a M-size PCB (excluding fiducial mark finding and loading time.) It's also safe for pre-flow inspection. |
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High-Resolution Imaging System |
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The unique optical resolution (10, 15, 20, and 25 um) and 3CCD XGA color camera (top view) with precision motion delivers 250 frame/sec standard XGA format image (1024*768 pixel). TR7500E supports 10um high resolution for a 01005 chip. |
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High Defect Coverage |
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New RGB lighting control is easy for debug, exterior comparison especially. 3D solder fillet reconstruction provides more accurate and stable capability to inspect the solder fillet on small components such as 0201 and fine pitch leads. |
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Modularized Control System |
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The precision X-Y table, conveyor system, Image acquisition, lighting system and host PC are all independent modular systems providing easy system fault diagnostics and maintenance. |
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Programming Environment |
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Direct programming by using CAD data. Only 5 data fields are necessary:
1.component name 2.package type 3.X-position 4.Y-position 5.rotation angle. |
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Graphical lighting tool for new powerful RGB+W color light setting and programming. |
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Accurate warp compensation and fiducial finding algorithm provides correct positioning of inspection windows that leads to high and repeatable defect detection. |
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